Bluetooth OEM Modules

Bluetooth OEM Modules

SENA's Bluetooth OEM Module product line is designed for users who wish to embed Bluetooth connectivity directly onto the circuit boards of RS232 based equipment. Bluetooth OEM Module can be connected to the device via built-in UART interface and communicate with other Bluetooth enabled devices such as mobile phones, handheld computers and laptops

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BCD110SC-00 : Bluetooth Embedded OEM SMD, Class 1, chip antenna.
The Parani-BCD110 is a Bluetooth Class1 OEM SMD/DIP module combining antenna for OEM manufactures wh..
$22.44
Ex GST: $20.40
BCD110SU-00 : Bluetooth Embedded OEM SMD, Class 1, U.FL Connector.
The Parani-BCD110 is a Bluetooth Class1 OEM SMD/DIP module combining antenna for OEM manufactures wh..
$22.44
Ex GST: $20.40
BCD110DC-02 : Bluetooth Embedded OEM DIP, Class 1, Chip Antenna. HCI Firmware
The Parani-BCD110 is a Bluetooth Class1 OEM SMD/DIP module combining antenna for OEM manufactures wh..
BCD110DU-02 : Bluetooth Embedded OEM DIP, Class 1, U.FL Connector. HCI Firmware
The Parani-BCD110 is a Bluetooth Class1 OEM SMD/DIP module combining antenna for OEM manufactures wh..
BCD110SC-02 : Bluetooth Embedded OEM SMD, Class 1, Chip Antenna. MOQ 100. HCI Firmware
The Parani-BCD110 is a Bluetooth Class1 OEM SMD/DIP module combining antenna for OEM manufactures wh..
BCD110SK-01 : Bluetooth Embedded OEM DIP. Evaluation Starter Kit
The Parani-BCD110 is a Bluetooth Class1 OEM SMD/DIP module combining antenna for OEM manufactures wh..
BCD110SK-03 : Bluetooth Embedded OEM DIP. Evaluation Starter Kit. HCI Firmware
The Parani-BCD110 is a Bluetooth Class1 OEM SMD/DIP module combining antenna for OEM manufactures wh..
BCD110SU-02 : Bluetooth Embedded OEM SMD, Class 1, U.FL Connector. MOQ 100. HCI Firmware
The Parani-BCD110 is a Bluetooth Class1 OEM SMD/DIP module combining antenna for OEM manufactures wh..
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