BCD210SC-02 : Bluetooth Embedded OEM, SMD, Class 2. Chip Antenna. MOQ 100. HCI Firmware

BCD210SC-02 : Bluetooth Embedded OEM, SMD, Class 2. Chip Antenna. MOQ 100. HCI Firmware
BCD210SC-02 - Product Brief  
BCD210SC-02 - Datasheet  
BCD210SC-02 - User Manual  

Price:
Ex Tax: $0.00
This product has a minimum quantity of 10
  Parani-BCD210
Bluetooth
Specifications		 Bluetooth v2.0 + EDR
Class2
Profile: SPP(Serial Port Profile)
Working distance:
By default antenna is 50m (0.031 mile)
supports up to 300m (0.186 mile) at line-of sight
Transmit Power +4dBm Typical
Receive Sensitivity -84dBm (0.1% BER)
TX Output Spectrum-Frequency range 2402 MHz - 2480 MHz
Interfaces UART, USB, I2C, PCM, PIO
Serial Interface
  • Serial UART speed up to 921.6kbps
  • CTS/RTS flow control, DTR/DSR for loop-back & full transfer
PIN Interface
  • BCD210Sx: 1.27mm SMD Pad 18x2 (36pin)
  • BCD210Dx: 1.27mm Pin Header 18x2 (36pin)
USB Interface V2.0
Configuration ParaniWIN, ParaniWizard, Modem AT command set
Firmware Update ParaniUpdater
Power Consumption
  • Nominal: 30mA @3.3VDC
  • Maximum: 60mA @3.3VDC (100mA @3.3VDC in Test Mode)
Environmental
  • Operating temperature: -40°C ~ 85°C
  • Storage temperature: -40°C ~ 85°C
  • Humidity: 90% (Non-condensing)
Physical properties Parani-BCD210 Dimension
  • DIP type
    16.8 (W) x 28 (L) x 8.0 (H) mm (0.661in x 1.102in x 0.315 in)
  • SMD type
    14.8 (W) x 28 (L) x 3.0 (H) mm (0.583in x 1.102in x 0.118 in)
Weight:
  • Parani-BCD210SC: 2g
  • Parani-BCD210SU: 2g
  • Parani-BCD210DC: 3g
  • Parani-BCD210DU: 3g
  • Parani-BCD210DS: 5g
Approvals FCC, CE, IC, KC, TELEC, SIG
Warranty 1-year limited warranty
Part Number Description  
BCD210SC-00   Bluetooth embedded OEM module SMD Type, Class 2 with chip antenna  
BCD210SU-00   Bluetooth embedded OEM module SMD Type, Class 2 with U.FL connector  
BCD210DC-00   Bluetooth embedded OEM module DIP Type, Class 2 with chip antenna  
BCD210DS-00   Bluetooth embedded OEM module DIP Type, Class 2 with RP-SMA connector  
BCD210DU-00   Bluetooth embedded OEM module DIP Type, Class 2 w/ U.FL connector  
BCD210SK-01   Starter kit for Parani-BCD210  
  Package contents:
  • BCD210DC 1
  • BCD210DS 1
  • BCD210DU 1
  • Development board 1
  • DC Power adapter 1
  • RS232 serial cable 1
  • Stub antenna 1
  • 3dBi Dipole antenna 1
  • U.FL cable 1
BCD210SC-02   Bluetooth embedded OEM module SMD Type, Class 2 with chip antenna (HCI)  
BCD210SU-02   Bluetooth embedded OEM module SMD Type, Class 2 with U.FL connector (HCI)  
BCD210DC-02   Bluetooth embedded OEM module DIP Type, Class 2 with chip antenna (HCI)  
BCD210DS-02   Bluetooth embedded OEM module DIP Type, Class 2 with RP-SMA connector (HCI)  
BCD210DU-02   Bluetooth embedded OEM module DIP Type, Class 2 w/ U.FL connector (HCI)  
BCD210SK-03   Starter kit for Parani-BCD210 (HCI)  
  Package contents:
  • BCD210DC 1
  • BCD210DS 1
  • BCD210DU 1
  • Development board 1
  • DC Power adapter 1
  • RS232 serial cable 1
  • Stub antenna 1
  • 3dBi Dipole antenna 1
  • U.FL cable 1


Optional Accessories

Part Number Description
SAT-G01R 1dBi Stub Antenna, RP-SMA Plug, Right-hand thread
DAT-G01R 3dBi Dipole Antenna, RP-SMA Plug, Right-hand Thread
DAT5-G01R 5dBi Dipole Antenna, RP-SMA Plug, Right-hand Thread
SEC-G01R 15cm RPSMA Antenna Extension Cable, Right-hand Thread
UEC-G01R 12cm U.FL to RPSMA Cable, Right-Hand Thread

BCD210SC-02 : Bluetooth Embedded OEM, SMD, Class 2. Chip Antenna. MOQ 100. HCI Firmware

The Parani-BCD210 is a low power embedded Bluetooth Class 2 OEM SMD/DIP module combining antenna for OEM manufactures who want to implement Bluetooth Class2 functionality with their products cost effectively and also in timely manner. 

The BCD210 supports Class 2 Bluetooth transmission level for shorter communication distance up to 300m at line-up sight. The BCD210 supports UART, USB, I2C, PCM, PIO interfaces for the communication with the OEM products.

The BCD210 is provided with Bluetooth v2.0+EDR compatible firmware runs internally for SPP (Serial Port Profile) applications by default. The SPP firmware supports up to 4 simultaneous multiple connections and is designed to work out-of-box for real world SPP applications such as POS (Point-of-sales), industrial automation, remote metering and other various applications. Optionally, the BCD210 can be supplied with only software stack up to HCI level so entire Bluetooth stack runs on the host side for the application such as USB dongles for computers or OEM manufacturers can even develop and embed their own firmware into the BCD210.

The BCD210 is fully qualified with Bluetooth v2.0+EDR specification so OEM manufacturers can save cost and time for overall OEM product certifications, which makes the BCD210 ideal solution for larger volume and cost sensitive applications.

  • Bluetooth Class 2
  • Bluetooth v2.0 + EDR specification
  • Low Power consumption: 30mA @3.3VDC
  • Transmit Power: +4dBm Typical
  • Receive sensitivity: -84dBm (0.1% BER)
  • Integrated 8Mbit Flash Memory
  • Supports Serial Port Profile (SPP)
  • Working distance (In an open field): Nom.50m, up to 300m
  • Supports chip, stub and dipole antennas
  • 802.11 co-existence
  • Standard HCI over UART or USB
  • Field-proven SPP (Serial Port Profile) firmware supporting up to 4 simultaneous multiple connections
  • Firmware upgrade via windows-based software (ParaniUpdater)
  • Easy to use Windows configuration tool available.
  • ROHS compliant